Chiplet Interconnect Inventor Eliyan Corporation Announced $60M Series B Financing

March 25, 2024Client News

Gunderson Dettmer represented client Eliyan Corporation, an inventor of a high performing chiplet interconnect, in its $60 million Series B financing co-led by Samsung Catalyst Fund and Tiger Global Management. Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications. The new capital will be used to continue its focus on the most pressing challenges facing the design and manufacturing of advanced AI chips that use multi-die architectures in either advanced packaging or standard organic substrates.

In the announcement of the transaction, Eliyan co-founder and CEO Ramin Farjadrad said, “This investment reflects the confidence in our approach to integrating multi-chip architectures that address the critical challenges of high costs, low yield, power consumption, manufacturing complexity, and size limitations. Our NuLink technology has achieved commercial readiness with tape outs in the most advanced processes, and is optimized for delivering the necessary high bandwidth, low latency, and low power capabilities. We thank all of our investors for their support of our vision of enabling the ultimate chiplet systems for the new AI era.”

The Gunderson Dettmer deal team was co-led by Andy Bradley and Sogoal Salari and included Aaron Fiske, Gregory Kinzelman, Michelle Lee, Garrett Darling, Shagun Parekh and Yeji Han.

Eliyan Corporation
Samsung Catalyst 
Tiger Global Management